Advanced Micro Devices this week again reiterated its roadmap for chips to be made using 32nm silicon-on-insulator (SOI) gate-first high-K metal gate (HKMG) process technology. The interim chief exec promised to launch code-named Llano accelerated processing units in Q2 2011, but to delay the highly-expected Bulldozer chips to "summer".
"We have entered a new phase with our 32nm ramp and are now sampling thousands of Llano products to a wide variety of OEMs and ODMs as they prepare for production in Q2," said Thomas Seifert, interim chief executive officer of AMD, during a conference call with financial analysts.
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