"The smartphone and tablet is the new killer application. We are seeing a design explosion at 28nm. We have 89 tape-outs in the pipeline," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
Showing posts with label Processor. Show all posts
Showing posts with label Processor. Show all posts
Monday, 16 May 2011
TSMC Expects Design Explosion with 28nm Chips
Taiwan Semiconductor Manufacturing Company believes that 28nm process technology opens a number of new doors for the company. The world's largest contract manufacturer of chips claims that it has almost ninety 28nm design wins and believes the new fabrication process will have high popularity among chip designers for ultra-portable devices.
"The smartphone and tablet is the new killer application. We are seeing a design explosion at 28nm. We have 89 tape-outs in the pipeline," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
"The smartphone and tablet is the new killer application. We are seeing a design explosion at 28nm. We have 89 tape-outs in the pipeline," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
Tuesday, 25 January 2011
IBM shows off its 20nm wafer at the Common Platform conference
IBM showed off a 20nm test wafer at the Common Platform conference last week. It is a Common Platform test chip, but exactly which one is not clear.
The chip is built on the LP or low power variant of the upcoming IBM 20nm process. Other than being gate last, not much has been revealed. Given the process it is on, it is probably one of the very latest common test chips, something the Common Platform guys were quite proud of.
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