Showing posts with label 22nm. Show all posts
Showing posts with label 22nm. Show all posts

Wednesday, 18 May 2011

OCZ's New Firmware Can Improve Performance, Realiability of 20nm-Class NAND Flash Memory

OCZ Technology Group on Monday introduced a new firmware technology for solid-state drives (SSDs) that can allow installation of inexpensive NAND flash memory manufactured using 20nm-class process technology into SSDs that require improved reliability.

Modern multi-level cell (MLC) flash memory that is produced using thin fabrication processors is generally less reliable than similar memory products made using older process technologies. However, manufacturers cannot keep using old manufacturing methods since they need to reduce their production costs. In a bid to maintain reliability, improve performance and lower manufacturing costs, new solid-state drive controllers and firmware technologies are needed.

OCZ Technology unveiled the Arowana Flash Translation Layer (FTL) from Indilinx. The firmware technology supports both existing and upcoming Indilinx controllers and can improve performance and enterprise capabilities and enables SSD suppliers to deploy cost-effective 20nm-class NAND flash memory.
The new Arowana FTL enhances performance of Indilinx controllers with HyperQueuing, which significantly increases sequential write speeds and random IOPS over the previous generation FTL. In addition, Arowana's support of 2xnm flash provides SSD suppliers with the ability to offer end users a more attractive product with lower cost NAND components. The new Arowana FTL also maximizes the life of low endurance flash with INXtend technology.

Read More Here

Monday, 16 May 2011

TSMC Does Not See Triple-Gate Transistors as Economically Viable Solution

Taiwan Semiconductor Manufacturing Company said that while Intel Corp's 22nm manufacturing technology with tri-gate transistors has a number of advantages, it has no plans to implement something similar in the generations to come.

"We need the ecosystem to be ready for FinFETs, which means design tools, IP, design kits and so on. For us 20-nm will be planar," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
 

Tuesday, 25 January 2011

IBM shows off its 20nm wafer at the Common Platform conference

IBM showed off a 20nm test wafer at the Common Platform conference last week. It is a Common Platform test chip, but exactly which one is not clear.
The chip is built on the LP or low power variant of the upcoming IBM 20nm process. Other than being gate last, not much has been revealed. Given the process it is on, it is probably one of the very latest common test chips, something the Common Platform guys were quite proud of.

Monday, 17 January 2011

Intel Expects a Lot from 22nm Fabrication Process.



Adoption of New Manufacturing Model to Cost Intel $9 Billion in 2011

With the transition to 22nm process technology that will start later this year Intel Corp. will also move to a new manufacturing model that will rely on four leading-edge fabs instead of three. The plan will cost Intel $9 billion this year, but Intel claims that with 22nm manufacturing process it will be able to enter a number of new markets.

"In support of expected strong unit growth in our core businesses and the movement of graphics transistors to our leading edge process technology, we are forecasting an increase in capital spending to $9 billion as we build and equip an incremental high volume manufacturing factory at 22nm," said Stacy Smith, chief financial officer of Intel, during the most recent quarterly conference call with financial analysts.

At present Intel expects to rapidly transit its PC and server processors as well as various chips for low-power and mobile applications to 22nm fabrication process. Since previously the company transited its Atom and low-cost products to newer nodes around a year after premium chips, but with the 22nm the latest fabrication process will be applied for the whole product stack.

"As we approach our 22nm transition, we are increasing our investments in manufacturing to capture what we believe is a significant opportunity for growth. [...] The market opportunities for our 22nm products are outstanding. As a result, we are growing from the model of three high volume leading-edge manufacturing fabs to four. Our 22nm process will be the foundation for growing PC and server segments, as well as a broad family of Atom-based SoCs, serving smartphones, tablets, smart TVs, and other embedded devices," said Paul Otellini, chief executive officer of Intel.

In fact, mobile devices seem to have a very high priority for the world's largest maker of microprocessors.
"We are building some on 32nm now and then the initial products on 22nm will be the mainstream microprocessors, because we want to use every early wafer we can for those products, but we will move as rapidly to 22nm as possible for the non-PC part of the product line," explained the head of Intel.
While it is very likely that Intel will start making commercial chips using 22nm fabrication process already in Q4 2011, the company itself does not want to make any official promises concerning mass production or revenue shipments just now.

"We have finished development of the process. We are in yield learning deployment right now, running test ships in there, ramping the yields up on the technology. We have completed the design of our first microprocessor and have working microprocessors on that technology. At this point in time our plan is to ramp production wafers of that technology in the second half of this year with products launched at some point to follow," said Mr. Otellini.

Among the most anticipated 22nm products from Intel are code-named Ivy Bridge microprocessors for desktops, laptops and servers as well as Knights Corner accelerator based on MIC [many Intel core] architecture. Intel has already confirmed that it does have working samples of 22nm chips.