Nvidia Corp. this week quietly introduced a new performance-mainstream graphics processing unit (GPU) called GeForce GTX 560. The new graphics board offers lower performance compared to the GeForce GTX 560 Titanium released earlier this year, but is also available at lower price-point and improves speed of its predecessor.
"Starting at $199, the GeForce GTX 560 joins its big brother, the previously launched GTX 560 Ti GPU, in delivering an awesome gaming experience in its price class for games running at 1080p, the world's most popular gaming resolution, according to Valve's Steam Hardware and Software Survey," a statement by Nvidia reads.
Nvidia GeForce GTX 560 graphics card is based on the GF114 graphics processing unit (GPU), an improved version of the GF104 made using 40nm fabrication process with reduced power consumption and improved layout. The model GTX 560 has 336 stream processing units, 56 texture units, 32 render back ends, 7 tessellation engines and well as 256-bit memory controller. Nvidia recommends to clock the GF114 chip of 560 at 810MHz - 950MHz, which means that its stream processors operate at 1620MHz - 1900MHz. The designer recommends partners to install 1GB of GDDR5 memory clocked at 4GHz - 4.40GHz onto the GeForce GTX 560 graphics cards.
The novelty fully supports DirectX 11, OpenGL 4, OpenCL 1 as well as all the modern functionality, including hardware decoding of high-definition stereo-3D video and so on. In addition, the novelty supports Nvidia-exclusive features, such as CUDA-exclusive GPGPU software, PhysX and proprietary 3DVision stereo-3D feature.
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Welcome to Jack-O-Bytes Reviews. This website reviews hardware and software available for computers. I also write step by step guides for hardware and software related tasks.
Wednesday, 18 May 2011
Intel: There Are No Advantages in Going to ARM
Chief executive officer of Intel Corp. ruled out possibilities of adopting ARM architecture for its chips aimed at ultra-mobile devices. The company believes that instead of paying royalties to ARM, it may achieve better financial results and performance by tuning-up its x86 micro-architecture for low power consumption.
"There is no advantage going [into the ARM camp], we would be beholden to someone else, beholden to ARM. We would pay royalties to them so it would lower the overall profits. I think we can do a better," said Paul Otellini, chief executive of Intel, during the company's meeting with financial analysts, reports Reuters news-agency.
Back in 2010 chief technology officer of Intel indicated that the company's code-named Medfield system-on-chip powered by Atom x86 core and PowerVR graphics engine would be more energy-efficient than powerful ARM-based SoCs. The company promised in late 2010 that the first smartphones powered by Medfield would be available in the second half of 2011, but at present the firm expects handsets featuring x86 technology to be released in the first half of 2012.
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"There is no advantage going [into the ARM camp], we would be beholden to someone else, beholden to ARM. We would pay royalties to them so it would lower the overall profits. I think we can do a better," said Paul Otellini, chief executive of Intel, during the company's meeting with financial analysts, reports Reuters news-agency.
Back in 2010 chief technology officer of Intel indicated that the company's code-named Medfield system-on-chip powered by Atom x86 core and PowerVR graphics engine would be more energy-efficient than powerful ARM-based SoCs. The company promised in late 2010 that the first smartphones powered by Medfield would be available in the second half of 2011, but at present the firm expects handsets featuring x86 technology to be released in the first half of 2012.
Read More Here
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IBM to Help Oracle Customers to Adopt IBM Software, Platforms
Amid the uncertainties caused by Oracle's decision to stop developing software for Intel Itanium-based mission critical platforms as well as rumoured intention to cancel support for non-Oracle Linux distributives, IBM recently announced new migration resources to help Oracle software clients move up to IBM software. The company also claims that its DB2 software is more cost-efficient than competing solutions from Oracle.
The new resources include no-charge financial and technology assessments, skills training courses, and proof of concepts to support clients ready to convert their Oracle investments to the latest in IBM software.
As part of the support plan, IBM will provide detailed financial analysis that shows cost savings clients can achieve by switching from Oracle Database and'20Oracle WebLogic to IBM DB2 and WebSphere software. A no-charge, customized technical evaluation and conversion plan will show clients how fast and easy it can be to move up from Oracle to IBM software.
In addition, IBM will offer a no-charge, more than 100 online and in-person skills training courses to add certified DB2 skills to Oracle Database developer and database administrator teams, and WebSphere expertise to Oracle software teams.
Read More Here
The new resources include no-charge financial and technology assessments, skills training courses, and proof of concepts to support clients ready to convert their Oracle investments to the latest in IBM software.
As part of the support plan, IBM will provide detailed financial analysis that shows cost savings clients can achieve by switching from Oracle Database and'20Oracle WebLogic to IBM DB2 and WebSphere software. A no-charge, customized technical evaluation and conversion plan will show clients how fast and easy it can be to move up from Oracle to IBM software.
In addition, IBM will offer a no-charge, more than 100 online and in-person skills training courses to add certified DB2 skills to Oracle Database developer and database administrator teams, and WebSphere expertise to Oracle software teams.
Read More Here
Images, Details of AMD Fusion "Llano" Mainboards Transpire
EliteGroup Computer Systems (ECS) this week officially unveiled details about its mainboards designed for AMD A-series "Fusion Llano" accelerated processing units (APUs). In addition, the first picture of a high-end ECS motherboard for A-series chips emerged on the Internet.
ECS, one of the world's largest maker of motherboards, plans to release three A75F-series mainboards with FM1 socket for AMD code-named Llano A-series APUs. All three mainboards will be based on the AMD Hudson D3 (A75) Fusion controller hub (FCH), will support dual-channel DDR3 memory, PCI Express 2.0, Serial ATA-600, USB 3.0, high-definition audion and other advantages.
One of the mainboards - A75F-A "Black Deluxe - will be in ATX form-factor and will thus be aimed at more advanced end-users. For example, ECS A75F-A has passed 50°C burn test, presenting high quality and durability. In addition, based on the image of the mainboard that emerged on the Internet, the platform supports multi-GPU ATI CrossFireX technology which allows to install several discrete graphics cards, a feature typically found on high-end multimedia systems.
ECS A75F-AThe other two FM1 motherboards from ECS - A75F-M and A75F-M2 - will feature micro-ATX form-factor and will thus be aimed primarily at OEMs or system makers.
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ECS, one of the world's largest maker of motherboards, plans to release three A75F-series mainboards with FM1 socket for AMD code-named Llano A-series APUs. All three mainboards will be based on the AMD Hudson D3 (A75) Fusion controller hub (FCH), will support dual-channel DDR3 memory, PCI Express 2.0, Serial ATA-600, USB 3.0, high-definition audion and other advantages.
One of the mainboards - A75F-A "Black Deluxe - will be in ATX form-factor and will thus be aimed at more advanced end-users. For example, ECS A75F-A has passed 50°C burn test, presenting high quality and durability. In addition, based on the image of the mainboard that emerged on the Internet, the platform supports multi-GPU ATI CrossFireX technology which allows to install several discrete graphics cards, a feature typically found on high-end multimedia systems.
ECS A75F-A
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Nvidia Installs Flagship Graphics Chip onto Tesla Compute Card
Nvidia Corp. on Tuesday introduced its new high-end compute card designed for high-performance scientific computing. The novelty utilizes the company's latest code-named GF110 graphics processing unit, has 512 stream processors and delivers the industry's highest compute performance among specially designed accelerators.
Nvidia Tesla M2090 compute card is based on the code-named GF110 graphics processor clocked at 650/1300MHz that has all the 512 stream processors enabled. The board also has 6GB of GDDR5 memory with ECC clocked at 3.70GHz. Thanks to usage of the more advanced graphics processor for computing, the novelty delivers roughly 665GFLOPS of double precision performance, which is about 30% more horsepower than the predecessor M2070.
In the latest version of Amber 11, one of the most widely used applications for simulating behaviors of biomolecules, four Tesla M2090 GPUs coupled with four CPUs delivered record performance of 69 nanoseconds of simulation per day. The fastest AMBER performance recorded on a CPU-only supercomputer is 46 ns/day, according to Nvidia. In addition to AMBER, the Tesla M2090 GPU is well suited to a wide range of GPU-accelerated HPC applications.
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Nvidia Tesla M2090 compute card is based on the code-named GF110 graphics processor clocked at 650/1300MHz that has all the 512 stream processors enabled. The board also has 6GB of GDDR5 memory with ECC clocked at 3.70GHz. Thanks to usage of the more advanced graphics processor for computing, the novelty delivers roughly 665GFLOPS of double precision performance, which is about 30% more horsepower than the predecessor M2070.
Read More Here
Hewlett-Packard Does Not See Value in Thunderbolt - Company.
Hewlett-Packard, the world's largest maker of personal computers, said that it did not see the value in the Thunderbolt interconnection technology recently unveiled by Intel Corp. along with a number of partners. Instead, HP believes that USB 3.0 offers better value at present.
"We did look at [Thunderbolt]. We are still looking into it. Have not found a value proposition yet. On the PC side, everybody seems to be content with the expansion of USB 3.0. Do we need to go into more fancy solutions? Not convinced yet," said Xavier Lauwaert, worldwide marketing manager for desktops at HP, reports IDG News Service.
HP this week introduced a new lineup of high-end desktop personal computers called Pavilion HPE. The new family supports SuperSpeed USB interconnection standard and does not feature Intel Thunderbolt, which is currently supported by select Apple Macintosh personal computers and is also backed by a number of companies, primarily providers of professional solutions.
Although Intel has led the design of both Thunderbolt and USB 3.0, the company at present does not support USB 3.0 with its core-logic sets and only supports TB with standalone controllers. Next year the Santa Clara, California-based chipmaker plans to release chipsets with USB 3.0 support, but the destiny of integrated support of TB is not clear at this point. As a result, it is generally not surprising that PC makers are not too enthusiastic about the Thunderbolt.
Read More Here
"We did look at [Thunderbolt]. We are still looking into it. Have not found a value proposition yet. On the PC side, everybody seems to be content with the expansion of USB 3.0. Do we need to go into more fancy solutions? Not convinced yet," said Xavier Lauwaert, worldwide marketing manager for desktops at HP, reports IDG News Service.
HP this week introduced a new lineup of high-end desktop personal computers called Pavilion HPE. The new family supports SuperSpeed USB interconnection standard and does not feature Intel Thunderbolt, which is currently supported by select Apple Macintosh personal computers and is also backed by a number of companies, primarily providers of professional solutions.
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OCZ's New Firmware Can Improve Performance, Realiability of 20nm-Class NAND Flash Memory
OCZ Technology Group on Monday introduced a new firmware technology for solid-state drives (SSDs) that can allow installation of inexpensive NAND flash memory manufactured using 20nm-class process technology into SSDs that require improved reliability.
Modern multi-level cell (MLC) flash memory that is produced using thin fabrication processors is generally less reliable than similar memory products made using older process technologies. However, manufacturers cannot keep using old manufacturing methods since they need to reduce their production costs. In a bid to maintain reliability, improve performance and lower manufacturing costs, new solid-state drive controllers and firmware technologies are needed.
OCZ Technology unveiled the Arowana Flash Translation Layer (FTL) from Indilinx. The firmware technology supports both existing and upcoming Indilinx controllers and can improve performance and enterprise capabilities and enables SSD suppliers to deploy cost-effective 20nm-class NAND flash memory.
The new Arowana FTL enhances performance of Indilinx controllers with HyperQueuing, which significantly increases sequential write speeds and random IOPS over the previous generation FTL. In addition, Arowana's support of 2xnm flash provides SSD suppliers with the ability to offer end users a more attractive product with lower cost NAND components. The new Arowana FTL also maximizes the life of low endurance flash with INXtend technology.
Read More Here
Modern multi-level cell (MLC) flash memory that is produced using thin fabrication processors is generally less reliable than similar memory products made using older process technologies. However, manufacturers cannot keep using old manufacturing methods since they need to reduce their production costs. In a bid to maintain reliability, improve performance and lower manufacturing costs, new solid-state drive controllers and firmware technologies are needed.
OCZ Technology unveiled the Arowana Flash Translation Layer (FTL) from Indilinx. The firmware technology supports both existing and upcoming Indilinx controllers and can improve performance and enterprise capabilities and enables SSD suppliers to deploy cost-effective 20nm-class NAND flash memory.
The new Arowana FTL enhances performance of Indilinx controllers with HyperQueuing, which significantly increases sequential write speeds and random IOPS over the previous generation FTL. In addition, Arowana's support of 2xnm flash provides SSD suppliers with the ability to offer end users a more attractive product with lower cost NAND components. The new Arowana FTL also maximizes the life of low endurance flash with INXtend technology.
Read More Here
Intel’s 2011 Investor Meeting - Intel’s Architecture Group: 14nm Airmont Atom In 2014
Today Intel is holding their annual investors meeting at their Santa Clara headquarters. In true Intel fashion it’s being treated as a big event (ed: it’s so big they ran out of lunch), as this is the company’s primary vehicle for addressing the investors holding their 125 billion dollars in shares; in essence it’s a reprise of their current and future technology plans as a pep-talk for investors. As such it’s not really a technical event, but it’s not uncommon for a few new technical details to shake out during the presentations.
There are a number of presentations throughout the day, including keynotes from Paul Otellini, and presentations from a number of Intel groups including the architecture group, the data center group, and the manufacturing group. If something is going to shake out it’s bound to be the architecture group, so this is where we’ll start.
Atom/SoC
A big part of the architecture group’s discussion focused on Atom/SoC. The 32nm Medfield Atom is due this year, so Intel has been laying out their plans for what they’re going to be doing with Medfield. Unsurprisingly, a big push with Medfield is to break into the SoC space in a way that Moorestown could not. Intel never managed any major design wins for smartphones with Moorestown, which is something they want to correct with Medfield. To that extent Intel has been showing off Medfield concept phones to show investors that it’s a viable product and to try to drum up support.
Intel's Medfield Concept Phone
There are a number of presentations throughout the day, including keynotes from Paul Otellini, and presentations from a number of Intel groups including the architecture group, the data center group, and the manufacturing group. If something is going to shake out it’s bound to be the architecture group, so this is where we’ll start.
Atom/SoC
A big part of the architecture group’s discussion focused on Atom/SoC. The 32nm Medfield Atom is due this year, so Intel has been laying out their plans for what they’re going to be doing with Medfield. Unsurprisingly, a big push with Medfield is to break into the SoC space in a way that Moorestown could not. Intel never managed any major design wins for smartphones with Moorestown, which is something they want to correct with Medfield. To that extent Intel has been showing off Medfield concept phones to show investors that it’s a viable product and to try to drum up support.
Intel's Medfield Concept Phone
Tuesday, 17 May 2011
Leaked iPhone 5/4S Case Shows New Features
Thanks to case leaks for whiffs of the next iPhone.
Case manufacturers are a great source of leaks about a future product's design. Without showing case makers the device early, a new product won't have the full line of accessories for it.
For one reason or another, people love to encase their smartphones in cases; and if the iPhone 4 is any indication of Apple's design direction, the next iPhone will likely find homes in many different cases.
A leaked case design out of China, as shown by Gadgets DNA, suggests that the next iPhone will have a bigger edge-to-edge screen design that could means a bigger LCD in the current iPhone 4's form factor.
Another new design feature is a second cut out hole on the back. Some believe it to be a relocation of the camera LED flash in an effort to improve low-light performance.
Read More - http://www.tomsguide.com/us/iphone-4s-iphone-5-case-leak,news-11207.html
Case manufacturers are a great source of leaks about a future product's design. Without showing case makers the device early, a new product won't have the full line of accessories for it.
For one reason or another, people love to encase their smartphones in cases; and if the iPhone 4 is any indication of Apple's design direction, the next iPhone will likely find homes in many different cases.
A leaked case design out of China, as shown by Gadgets DNA, suggests that the next iPhone will have a bigger edge-to-edge screen design that could means a bigger LCD in the current iPhone 4's form factor.
Another new design feature is a second cut out hole on the back. Some believe it to be a relocation of the camera LED flash in an effort to improve low-light performance.
Read More - http://www.tomsguide.com/us/iphone-4s-iphone-5-case-leak,news-11207.html
NVIDIA's GeForce GTX 560: The Top To Bottom Factory Overclock
NVIDIA’s GF104 and GF114 GPUs have been a solid success for the company so far. 10 months after GF104 launched the GTX 460 series, NVIDIA has slowly been supplementing and replacing their former $200 king. In January we saw the launch of the GF114 based GTX 560 Ti, which gave us our first look at what a fully enabled GF1x4 GPU could do. However the GTX 560 Ti was positioned above the GTX 460 series in both performance and price, so it was more an addition to their lineup than a replacement for GTX 460.
With each GF11x GPU effectively being a half-step above its GF10x predecessor, NVIDIA’s replacement strategy has been to split a 400 series card’s original market between two GF11x GPUs. For the GTX 460, on the low-end this was partially split off into the GTX 550 Ti, which came fairly close to the GTX 460 768MB’s performance. The GTX 460 1GB has remained in place however, and today NVIDIA is finally starting to change that with the GeForce GTX 560. Based upon the same GF114 GPU as the GTX 560 Ti, the GTX 560 will be the GTX 460 1GB’s eventual high-end successor and NVIDIA’s new $200 card.
The GTX 560 is basically a higher clocked version of the GTX 460 1GB. The GTX 460 used a cut-down configuration of the GF104, and GTX 560 will be doing the same with GF114. As a result both cards have the same 336 SPs, 7 SMs, 32 ROPs, 512KB of L2 cache, and 1GB of GDDR5 on a 256-bit memory bus. In terms of performance the deciding factor between the two will be the clockspeed, and in terms of power consumption the main factors will be a combination of clockspeed, voltage, and GF114’s transistor leakage improvements over GF104. All told, NVIDIA’s base configuration for a GTX 560 puts the card at 810MHz for the core clock and 4004MHz (data rate) for the memory clock, which compared to the reference GTX 460 1GB is 135MHz (20%) faster for the core clock and 404MHz (11%) faster for the memory clock. NVIDIA puts the TDP at 150W, which is 10W under the GTX 460 1GB.
Read More - http://www.anandtech.com/show/4344/nvidias-geforce-gtx-560-top-to-bottom-overclock
With each GF11x GPU effectively being a half-step above its GF10x predecessor, NVIDIA’s replacement strategy has been to split a 400 series card’s original market between two GF11x GPUs. For the GTX 460, on the low-end this was partially split off into the GTX 550 Ti, which came fairly close to the GTX 460 768MB’s performance. The GTX 460 1GB has remained in place however, and today NVIDIA is finally starting to change that with the GeForce GTX 560. Based upon the same GF114 GPU as the GTX 560 Ti, the GTX 560 will be the GTX 460 1GB’s eventual high-end successor and NVIDIA’s new $200 card.
GTX 570 | GTX 560 Ti | GTX 560 | GTX 460 1GB | |
Stream Processors | 480 | 384 | 336 | 336 |
Texture Address / Filtering | 60/60 | 64/64 | 56/56 | 56/56 |
ROPs | 40 | 32 | 32 | 32 |
Core Clock | 732MHz | 822MHz | >=810MHz | 675MHz |
Shader Clock | 1464MHz | 1644MHz | >=1620MHz | 1350MHz |
Memory Clock | 950MHz (3800MHz data rate) GDDR5 | 1002Mhz (4008MHz data rate) GDDR5 | >=1001Mhz (4004MHz data rate) GDDR5 | 900Mhz (3.6GHz data rate) GDDR5 |
Memory Bus Width | 320-bit | 256-bit | 256-bit | 256-bit |
Frame Buffer | 1.25GB | 1GB | 1GB | 1GB |
FP64 | 1/8 FP32 | 1/12 FP32 | 1/12 FP32 | 1/12 FP32 |
Transistor Count | 3B | 1.95B | 1.95B | 1.95B |
Manufacturing Process | TSMC 40nm | TSMC 40nm | TSMC 40nm | TSMC 40nm |
Price Point | $329 | ~$239 | ~$199 | ~$160 |
The GTX 560 is basically a higher clocked version of the GTX 460 1GB. The GTX 460 used a cut-down configuration of the GF104, and GTX 560 will be doing the same with GF114. As a result both cards have the same 336 SPs, 7 SMs, 32 ROPs, 512KB of L2 cache, and 1GB of GDDR5 on a 256-bit memory bus. In terms of performance the deciding factor between the two will be the clockspeed, and in terms of power consumption the main factors will be a combination of clockspeed, voltage, and GF114’s transistor leakage improvements over GF104. All told, NVIDIA’s base configuration for a GTX 560 puts the card at 810MHz for the core clock and 4004MHz (data rate) for the memory clock, which compared to the reference GTX 460 1GB is 135MHz (20%) faster for the core clock and 404MHz (11%) faster for the memory clock. NVIDIA puts the TDP at 150W, which is 10W under the GTX 460 1GB.
Read More - http://www.anandtech.com/show/4344/nvidias-geforce-gtx-560-top-to-bottom-overclock
Corsair TX750 V2: New and Improved
Introduction, Package Contents, and Specifications
Today we continue with the second part of our series of 750W power supplies. The Corsair TX V2 is the second 80 Plus Bronze certified PSU with non-modular cables that we're looking at for this range. Corsair might be a leading manufacturer of RAM modules and SSDs, but power supply quality depends largely on the ODM and their design. The big question of the PSU source is easy to answer. Seasonic is the company behind many Corsair products—and they're definitely a good choice, much better than using CWT like the original TX750—but what about the internal design and components?
Corsair's TX V2 750W includes a power cord for the American power grid, four screws, one Corsair sticker (for your case), and a manual. The latter is more like a warranty agreement than a helping hand. There is an installation guide, but the warranty part shows some interesting limitations. "[Corsair] shall not be liable for any special, incidental, indirect or consequential damages [...] including [...] loss of profits, revenue, or data." So the 5-year warranty won't help you, other than getting a new PSU should the TX750 go belly up. Don't worry, though; these are common terms and are present with nearly every PSU.
Read More - http://www.anandtech.com/show/4311/corsair-tx750-v2-new-and-improved
Today we continue with the second part of our series of 750W power supplies. The Corsair TX V2 is the second 80 Plus Bronze certified PSU with non-modular cables that we're looking at for this range. Corsair might be a leading manufacturer of RAM modules and SSDs, but power supply quality depends largely on the ODM and their design. The big question of the PSU source is easy to answer. Seasonic is the company behind many Corsair products—and they're definitely a good choice, much better than using CWT like the original TX750—but what about the internal design and components?
Corsair's TX V2 750W includes a power cord for the American power grid, four screws, one Corsair sticker (for your case), and a manual. The latter is more like a warranty agreement than a helping hand. There is an installation guide, but the warranty part shows some interesting limitations. "[Corsair] shall not be liable for any special, incidental, indirect or consequential damages [...] including [...] loss of profits, revenue, or data." So the 5-year warranty won't help you, other than getting a new PSU should the TX750 go belly up. Don't worry, though; these are common terms and are present with nearly every PSU.
Read More - http://www.anandtech.com/show/4311/corsair-tx750-v2-new-and-improved
Lenovo X1 Announced Alongside An Edge Infused All-In-One
Today Lenovo brings thin and Sandy Bridge to your desks and your laps. Leaked last month, the Lenovo ThinkPad X1 will make a strong case for itself to corporate road warriors while also packing some features that might appeal to consumers. Lenovo also has the newly revealed ThinkCentre Edge 91z, which introduces the Edge aesthetic to the ThinkCentre all-in-one (AIO) line. The ThinkCentre's space-saving form factor and mix of desktop and mobile components should appeal to the IT at home users, and makes a nice addition to your desk. As review units roll in we will see just how well these measure up against their competition.
We'll start with a look at the Lenovo ThinkPad X1, which we saw leaks of recently. Leaks or no leaks, this ultraportable notebook turns out to pack some suprises in its svelte frame. Measuring 16.5mm at its thinnest (the front edge) and 21.5mm at its thickest (the back edge) the X1 will not compete for thinnest laptop on the market, but it may just be the thinnest with a full voltage Sandy Bridge mobile processor. The 13.3" screen is optimized for travelers with a pane of Corning's Gorilla Glass covering its TN-panel (we confirmed this with Lenovo Product Manager Jason Parrish) and peaking at a reported 350 nits at a resolution of 1366x768. We'll reserve judgment on the panel till we get our hands on it; truth is, in a market bereft of IPS displays, even a 768p TN-panel can land near the top of our display charts. In a move that many of you have been asking for on Apple's MacBook Pro line, Lenovo provides both mini-DisplayPort and HDMI for connectivity along with Intel's Wireless Display technology.
We'll start with a look at the Lenovo ThinkPad X1, which we saw leaks of recently. Leaks or no leaks, this ultraportable notebook turns out to pack some suprises in its svelte frame. Measuring 16.5mm at its thinnest (the front edge) and 21.5mm at its thickest (the back edge) the X1 will not compete for thinnest laptop on the market, but it may just be the thinnest with a full voltage Sandy Bridge mobile processor. The 13.3" screen is optimized for travelers with a pane of Corning's Gorilla Glass covering its TN-panel (we confirmed this with Lenovo Product Manager Jason Parrish) and peaking at a reported 350 nits at a resolution of 1366x768. We'll reserve judgment on the panel till we get our hands on it; truth is, in a market bereft of IPS displays, even a 768p TN-panel can land near the top of our display charts. In a move that many of you have been asking for on Apple's MacBook Pro line, Lenovo provides both mini-DisplayPort and HDMI for connectivity along with Intel's Wireless Display technology.
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Monday, 16 May 2011
Sony Restores PSN Services Around the World
The drought is over.
Sony Saturday began its phased reintroduction of the PlayStation Network and Qriocity services. The progression comes roughly one week after Sony missed its own projected deadline for the PSN restart. Since things kicked off during the weekend, Sony has restored PSN and Qriocity services to all of the United States and Canada.
Included as part of the restart is a mandatory software update that forces users to change their account passwords. This update was actually made available on Saturday, prior to the restoration, but Sony recommended people update in preparation for PSN being back online
Read More - http://www.tomsguide.com/us/PSN-Qriocity-Back-Online-Password-Reset-PSN-Update,news-11205.html
Sony Saturday began its phased reintroduction of the PlayStation Network and Qriocity services. The progression comes roughly one week after Sony missed its own projected deadline for the PSN restart. Since things kicked off during the weekend, Sony has restored PSN and Qriocity services to all of the United States and Canada.
Kazuo Hirai - PSN Relaunch Announcement
Included as part of the restart is a mandatory software update that forces users to change their account passwords. This update was actually made available on Saturday, prior to the restoration, but Sony recommended people update in preparation for PSN being back online
Read More - http://www.tomsguide.com/us/PSN-Qriocity-Back-Online-Password-Reset-PSN-Update,news-11205.html
Vodafone Reveals Own-brand £80 Smartphone
Vodafone has launched a cheap and cheerful Android smartphone for users that don’t want to sign a contract but can’t afford to fork out an arm and a leg for an off-contract smartphone.
It’s fairly easy to get an off-contract smartphone. All you need is roughly £300-£400. However, a lot of people don’t have £400 to splash on phones, and, as a result, they’re often forced to sign lengthy contracts if they want a fancy smartphone with all the bells and whistles. However, Vodafone’s now got a cheap alternative for those in the market for a smartphone and on a budget.
Read More - http://www.tomshardware.co.uk/Vodafone-Android-Smart-Smart-858-858-Release-Date,news-35593.html
It’s fairly easy to get an off-contract smartphone. All you need is roughly £300-£400. However, a lot of people don’t have £400 to splash on phones, and, as a result, they’re often forced to sign lengthy contracts if they want a fancy smartphone with all the bells and whistles. However, Vodafone’s now got a cheap alternative for those in the market for a smartphone and on a budget.
Read More - http://www.tomshardware.co.uk/Vodafone-Android-Smart-Smart-858-858-Release-Date,news-35593.html
Google Says Windows is Torturing Users
Them's Fightin Words
Google yesterday unleashed the full details on the public launch of the Chrome OS notebooks – or what the company now calls Chromebooks.
It's the big push by Google to run the desktop and laptop world with the idea to take away market share from Microsoft by relieving users and support staff of "torture" from Windows.
"With Microsoft, and other operating system vendors, I think the complexity of managing your computer is really torturing users," Google co-founder Sergey Brin said, quoted by Network World. "It's torturing everyone in this room. It's a flawed model fundamentally. Chromebooks are a new model that doesn't put the burden of managing the computer on yourself."
Read More - http://www.tomshardware.co.uk/google-windows-torture-chrome-os,news-35595.html
Google yesterday unleashed the full details on the public launch of the Chrome OS notebooks – or what the company now calls Chromebooks.
It's the big push by Google to run the desktop and laptop world with the idea to take away market share from Microsoft by relieving users and support staff of "torture" from Windows.
"With Microsoft, and other operating system vendors, I think the complexity of managing your computer is really torturing users," Google co-founder Sergey Brin said, quoted by Network World. "It's torturing everyone in this room. It's a flawed model fundamentally. Chromebooks are a new model that doesn't put the burden of managing the computer on yourself."
Read More - http://www.tomshardware.co.uk/google-windows-torture-chrome-os,news-35595.html
Google Wants Nevada to OK Driverless Cars
Perfect for the Sin City lifestyle.
We've all seen the science fiction movies where the cars drive themselves and all we puny humans do is just ride as passengers. Like how we get to have the internet at our fingertips with our smartphones, soon we may have automated cars that don't require us to drive in order to get from one point to another.
Google's been testing driverless Toyota Prius and Audi TT cars in California, and now the company is looking to Nevada to allow driverless cars. In a state when the illegal is legal, Google hired David Goldwater, a lobbyist based in Las Vegas, to promote the allowance of licensing and testing of autonomous vehicles, as well as to allow texting while in such a vehicle.
Read more - http://www.tomsguide.com/us/google-driveless-cars-automated-driver,news-11172.html
We've all seen the science fiction movies where the cars drive themselves and all we puny humans do is just ride as passengers. Like how we get to have the internet at our fingertips with our smartphones, soon we may have automated cars that don't require us to drive in order to get from one point to another.
Google's been testing driverless Toyota Prius and Audi TT cars in California, and now the company is looking to Nevada to allow driverless cars. In a state when the illegal is legal, Google hired David Goldwater, a lobbyist based in Las Vegas, to promote the allowance of licensing and testing of autonomous vehicles, as well as to allow texting while in such a vehicle.
Read more - http://www.tomsguide.com/us/google-driveless-cars-automated-driver,news-11172.html
Scientists Create a ''Schizophrenic'' Computer
Fake brains used to study real brains.
Despite all the major advancements in our information age, the world's most complex supercomputer is still the human brain. We may not have tri-gate 3D transistors or the ability to parse information like Watson, but our brains work in ways that computers simply can't. Of course, that could just be because science isn't there yet.
Scientists are making a headway though, as researchers at Yale and the University of Texas are afflicting computers with symptoms of schizophrenia in an effort to better the understanding of the human mind.
One theory about schizophrenia is that the brain loses the ability to forget or ignore information that's largely irrelevant. Without this filter, the brain is unable to extract meaningfulness out of experiences. Scientists are using this hypothesis in its computer model called DISCERN which could mimic schizophrenia.
Read More - http://www.tomshardware.co.uk/Schizophrenic-computer-Schizophrenia-brain-study,news-35591.html
Despite all the major advancements in our information age, the world's most complex supercomputer is still the human brain. We may not have tri-gate 3D transistors or the ability to parse information like Watson, but our brains work in ways that computers simply can't. Of course, that could just be because science isn't there yet.
Scientists are making a headway though, as researchers at Yale and the University of Texas are afflicting computers with symptoms of schizophrenia in an effort to better the understanding of the human mind.
One theory about schizophrenia is that the brain loses the ability to forget or ignore information that's largely irrelevant. Without this filter, the brain is unable to extract meaningfulness out of experiences. Scientists are using this hypothesis in its computer model called DISCERN which could mimic schizophrenia.
Read More - http://www.tomshardware.co.uk/Schizophrenic-computer-Schizophrenia-brain-study,news-35591.html
TSMC Does Not See Triple-Gate Transistors as Economically Viable Solution
Taiwan Semiconductor Manufacturing Company said that while Intel Corp's 22nm manufacturing technology with tri-gate transistors has a number of advantages, it has no plans to implement something similar in the generations to come.
"We need the ecosystem to be ready for FinFETs, which means design tools, IP, design kits and so on. For us 20-nm will be planar," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
"We need the ecosystem to be ready for FinFETs, which means design tools, IP, design kits and so on. For us 20-nm will be planar," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
Labels:
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DTS Brings High-Definition Audio to Mobile Phones.
DTS, a designer of high-definition audio solutions, has announced that the T-Mobile G2x with Google by LG, specifically designed for gamers and music lovers, are the first smartphone to integrate DTS Ultra Mobile, a technology that brings high-quality sound to mobile consumers.
"Today’s consumers not only demand the best quality, they expect it in all of their electronics, especially smartphones. The DTS integration creates a rich, enhanced sound with depth and dimensionality - bringing a unique and compelling option to market that’s tailored to those using smartphones for gaming and music enjoyment," said Randy Meyerson, director, product management, T-Mobile USA.
The DTS Ultra Mobile solution includes two innovative audio technologies - DTS Envelo and DTS Boost - that together offer consumers a "richer, warmer and more engaging" experience when listening to music or playing games on the T-Mobile G2x smartphone.
Read More - http://www.xbitlabs.com/news/multimedia/display/20110515175951_DTS_Brings_High_Definition_Audio_to_Mobile_Phones.html
TSMC Expects Design Explosion with 28nm Chips
Taiwan Semiconductor Manufacturing Company believes that 28nm process technology opens a number of new doors for the company. The world's largest contract manufacturer of chips claims that it has almost ninety 28nm design wins and believes the new fabrication process will have high popularity among chip designers for ultra-portable devices.
"The smartphone and tablet is the new killer application. We are seeing a design explosion at 28nm. We have 89 tape-outs in the pipeline," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
"The smartphone and tablet is the new killer application. We are seeing a design explosion at 28nm. We have 89 tape-outs in the pipeline," said Maria Marced, president of TSMC Europe, in an interview with EETimes web-site.
Labels:
28nm,
architecture,
Designs,
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TSMC
OCZ Announces Enterprise-Grade 960GB Solid-State Drive.
OCZ Technology Group, a leading provider of solid-state drives, has announced its new enterprise-grade solid-state drive (SSD) with Serial Attached SCSI (SAS) interface along with proprietary controller architecture. The new Talos drives combine high reliability with high capacity (from 200GB to 960GB) and maximized input/output performance.
Talos SSDs are available in 3.5" form factors (2.5" to follow) and range from 200GB to 960GB. Talos SAS SSDs deliver speed with up to 64 000 4K random IOPS [input/output operations per second] and are specifically optimized for enterprise storage applications, providing clients who require substantial transactional processing with superior performance and cost-savings. Additionally, the Talos SAS interface offers the benefits of interoperability and integration with existing devices, flexibility for traditional storage environments, and the ability to scale greater amounts of drives, providing larger aggregate pools of storage. The drives also deliver reliability features including superior power loss protection, endurance, encryption, and ECC protection.
Talos SSDs are available in 3.5" form factors (2.5" to follow) and range from 200GB to 960GB. Talos SAS SSDs deliver speed with up to 64 000 4K random IOPS [input/output operations per second] and are specifically optimized for enterprise storage applications, providing clients who require substantial transactional processing with superior performance and cost-savings. Additionally, the Talos SAS interface offers the benefits of interoperability and integration with existing devices, flexibility for traditional storage environments, and the ability to scale greater amounts of drives, providing larger aggregate pools of storage. The drives also deliver reliability features including superior power loss protection, endurance, encryption, and ECC protection.
Nvidia to Release New Version of Dual-Chip Flagship Graphics Card
Nvidia Corp. plans to release a new version of its dual-chip flagship GeForce GTX graphics card that will be more overclockable. The company intends to re-invent print-circuit board of the graphics card in a bid to improve its reliability in cases of overclocking, a media report claims.
The new GeForce GTX 590 graphics card - which is powered by two code-named GF110 graphics processing units (GPUs) and features 3GB of GDDR5 memory - will have new inductors, larger printed circuit board (PCB) and a new cooling solutions, reports VR-Zone web-site. The new inductors and design will eliminate possibility of failure during overclocking, which is something that enthusiasts demand from a top-of-the-range graphics cards.
The new GeForce GTX 590 graphics card - which is powered by two code-named GF110 graphics processing units (GPUs) and features 3GB of GDDR5 memory - will have new inductors, larger printed circuit board (PCB) and a new cooling solutions, reports VR-Zone web-site. The new inductors and design will eliminate possibility of failure during overclocking, which is something that enthusiasts demand from a top-of-the-range graphics cards.
Saturday, 14 May 2011
ASUS P8Z68-V Pro Z68 Chipset Motherboard Review
When Intel brought out the P67 and H67 chipsets, many enthusiasts complained that the features of one or the other were only available on one or the other, but not both. Intel has heard the community and is therefore launching the Z68 chipset. As usual ASUS is among the first board makers to offer a board featuring this latest chipset. The ASUS P8Z68-V Pro promises to be an interesting first look at this new chipset
You’ve probably owned ASUS built products without even knowing it. It makes everything from motherboards to monitors, to consumer electronics, and more. Founded in 1986 ASUS has become one of the largest consumer electronics manufacturers in the world and is probably the largest motherboard manufacturer on the planet, surely when it comes to retail box packages.
The ASUS P8Z68-V Pro is based on Intel’s brand new Z68 Express chipset. Less than six months ago Intel launched two chipsets. P67 and H67.
The former was targeted towards mainstream and some enthusiast users. This chipset offered the ability to overclocked multiplier unlocked K series parts with impunity. At least, through turbo multipliers. The H67 chipset on the other hand featured support for Intel’s Integrated Graphics Processors, or IGPUs which are part of the Sandy Bridge core processors’ dies. Furthermore Intel’s quick sync feature was tied to H67 and anyone who might have wanted to take advantage of these features had to choose between using the IGPU’s and Quick Sync or overclocking. This didn’t sit well with many enthusiasts and of course, many people made their opinions on this well known. Well if Z68 proves anything, it’s that Intel has been listening. No longer must you choose between the feature sets of P67 and H67. You can now have both feature sets and more. And when we say "more" there is a LOT more.
Read More - http://www.hardocp.com/article/2011/05/11/asus_p8z68v_pro_z68_chipset_motherboard_review
Introduction
You’ve probably owned ASUS built products without even knowing it. It makes everything from motherboards to monitors, to consumer electronics, and more. Founded in 1986 ASUS has become one of the largest consumer electronics manufacturers in the world and is probably the largest motherboard manufacturer on the planet, surely when it comes to retail box packages.
The ASUS P8Z68-V Pro is based on Intel’s brand new Z68 Express chipset. Less than six months ago Intel launched two chipsets. P67 and H67.
The former was targeted towards mainstream and some enthusiast users. This chipset offered the ability to overclocked multiplier unlocked K series parts with impunity. At least, through turbo multipliers. The H67 chipset on the other hand featured support for Intel’s Integrated Graphics Processors, or IGPUs which are part of the Sandy Bridge core processors’ dies. Furthermore Intel’s quick sync feature was tied to H67 and anyone who might have wanted to take advantage of these features had to choose between using the IGPU’s and Quick Sync or overclocking. This didn’t sit well with many enthusiasts and of course, many people made their opinions on this well known. Well if Z68 proves anything, it’s that Intel has been listening. No longer must you choose between the feature sets of P67 and H67. You can now have both feature sets and more. And when we say "more" there is a LOT more.
Read More - http://www.hardocp.com/article/2011/05/11/asus_p8z68v_pro_z68_chipset_motherboard_review
Intel Smart Response Technology - SRT
Introduction
Intel is among a small list of solid state controller manufactures producing enthusiast class products. By nature, SSDs are still considered premium products with large performance benefits over traditional platter based hard drives but the performance isn’t what constitutes a premium category listing. SSDs cost considerably more than traditional spinners and the cost vs. capacity ratio is much higher. Technology improvements have brought this ratio down for SSDs but the same can also be said for traditional HDDs as well. For some, the imbalance is just too wide to consider a move to high speed, low capacity solid state technology.
Solid state technology improves the user experience two ways, one you can see and one you can feel. They say seeing is believing and it’s possible to show with graphs and plotted lines sequential performance. SSDs are now capable of delivering 500MB/s read and write speeds when asked to perform a straight sequence. This is a 3x increase over the highest performing traditional HDD. A 3x increase in what’s still the slowest performing component in your computer system is significant but it’s not what enhances the user experience in day to day tasks. To put this into a personal perspective, ask yourself how often you transfer a DVD, Blu-Ray ISO or other large file from one location to another. These are sequential tasks.
While you are questioning yourself go ahead and ask how often you open a web browser, application, turn on your PC and for that matter double click on anything found on your boot drive. SSDs sequential read and write speeds get most of the marketing attention because big numbers look better in advertisements. The user experience comes from small numbers, numbers measured in microseconds
Read More - http://www.hardocp.com/article/2011/05/11/intel_smart_response_technology_srt
John Carmack: Modern Graphics Cards from AMD or Nvidia are Insanely Powerful.
Legendary Video Game Designer Finds Pros and Cons of GeForce and Radeon Graphics Cards
John Carmack, a well-known developer of video games, believes that modern graphics cards by ATI/AMD and Nvidia Corp. are powerful enough to handle very complex games. However, the company that can better help game developers to optimize their games for their hardware will eventually automatically provide better solutions for those titles, Mr. Carmack believes.
“You almost cannot make a bad decision with graphics cards nowadays. Any of the add-in cards from AMD or Nvidia are all insanely powerful,” said John Carmack, the lead programmer at id Software, the game developer behind Doom, Quake, Wolfenstein and other popular title, in an interview with PC Gamer web-site.
Even though Mr. Carmack does not give any recommendations for buyers, he claims that the hardware from a vendor that better supports game designers can potentially offer better solutions to end users.
Read More - http://www.xbitlabs.com/news/multimedia/display/20110513155252_John_Carmack_Modern_Graphics_Cards_from_AMD_or_Nvidia_are_Insanely_Powerful.html
John Carmack, a well-known developer of video games, believes that modern graphics cards by ATI/AMD and Nvidia Corp. are powerful enough to handle very complex games. However, the company that can better help game developers to optimize their games for their hardware will eventually automatically provide better solutions for those titles, Mr. Carmack believes.
“You almost cannot make a bad decision with graphics cards nowadays. Any of the add-in cards from AMD or Nvidia are all insanely powerful,” said John Carmack, the lead programmer at id Software, the game developer behind Doom, Quake, Wolfenstein and other popular title, in an interview with PC Gamer web-site.
Read More - http://www.xbitlabs.com/news/multimedia/display/20110513155252_John_Carmack_Modern_Graphics_Cards_from_AMD_or_Nvidia_are_Insanely_Powerful.html
CyberPower's X6-9300 and MSI's GT680R: Fighting for Your Mobile Gaming Dollar
The Fight for Your Mobile Gaming Dollar
At a macro level, there really aren’t all that many viable gaming notebook options. These days, Sandy Bridge processors rule the roost in notebooks, with the quad-core variety handling everything from single-threaded to multi-threaded workloads with aplomb. On the graphics side, you can try to get by with midrange mobile GPUs, but if you’re serious about mobile gaming you’ll want at least something from NVIDIA’s GTX line or AMD’s 6900M alternatives. Take the CPU and GPU; match them up with reasonable memory, storage, display, and other accoutrements; and you’re all set. That all works very well in the desktop world, even if it glosses over many of the finer points that separate the contenders from the pretenders. In the mobile world, however, the little things matter.
Modern computers are very modular by design. We have standards for power, memory, storage, and peripherals and you can generally choose what fits your needs. With notebooks, however, a lot of flexibility gets sacrificed in the name of making a reasonably sized chassis. Not coincidentally, profit margins tend to be quite a bit higher for notebooks than desktops, which is why so many companies want a piece of the pie. While it’s still pretty easy to upgrade memory and storage options, swapping out the CPU for something faster is more difficult and you need to make sure the cooling setup can handle any additional heat. Upgrading your GPU on the other hand is difficult at best, and frequently impossible. The issue with mobile GPUs is that despite MXM being something of a standard, chip locations are left up to the implementation, so there’s no guarantee that, for example, an HD 6770M could be installed in place of a GT 540M. And as far as the LCD, keyboard, touchpad, motherboard, and chassis are concerned, you’re stuck with whatever you buy with no chance of upgrading individual parts in the future. (Okay, perhaps you could upgrade the LCD panel in some cases, but you get what we’re saying.)
At a macro level, there really aren’t all that many viable gaming notebook options. These days, Sandy Bridge processors rule the roost in notebooks, with the quad-core variety handling everything from single-threaded to multi-threaded workloads with aplomb. On the graphics side, you can try to get by with midrange mobile GPUs, but if you’re serious about mobile gaming you’ll want at least something from NVIDIA’s GTX line or AMD’s 6900M alternatives. Take the CPU and GPU; match them up with reasonable memory, storage, display, and other accoutrements; and you’re all set. That all works very well in the desktop world, even if it glosses over many of the finer points that separate the contenders from the pretenders. In the mobile world, however, the little things matter.
Modern computers are very modular by design. We have standards for power, memory, storage, and peripherals and you can generally choose what fits your needs. With notebooks, however, a lot of flexibility gets sacrificed in the name of making a reasonably sized chassis. Not coincidentally, profit margins tend to be quite a bit higher for notebooks than desktops, which is why so many companies want a piece of the pie. While it’s still pretty easy to upgrade memory and storage options, swapping out the CPU for something faster is more difficult and you need to make sure the cooling setup can handle any additional heat. Upgrading your GPU on the other hand is difficult at best, and frequently impossible. The issue with mobile GPUs is that despite MXM being something of a standard, chip locations are left up to the implementation, so there’s no guarantee that, for example, an HD 6770M could be installed in place of a GT 540M. And as far as the LCD, keyboard, touchpad, motherboard, and chassis are concerned, you’re stuck with whatever you buy with no chance of upgrading individual parts in the future. (Okay, perhaps you could upgrade the LCD panel in some cases, but you get what we’re saying.)
Friday, 13 May 2011
OCZ Technology Reveals Mainstream SSDs with Serial ATA-600 Interface.
OCZ Technology Group this week released two new families of solid-state drives with Serial ATA-600 interface and relatively low price. The new Agility 3 and Solid 3 drives feature SandForce SF-2200-series controller and provide maximum read speed of around 500MB/s, which is tremendous speed for mainstream solid-state drives.
Both OCZ Agility 3 and OCZ Solid 3 are based on multi-level cell (MLC) NAND flash memory made using 20nm-class process technology, are powered by SandForce SF-2281 controller, support TRIM technology, use Serial ATA-600 interface. The drives have similar 2.5" form-factors, weights, operating temperatures, power consumption, shock resistance and so on. Both drives feature ECC capability with up to 55 bits correctable per 512-byte sector. The main difference between the two drives is much higher IOPS [input/output operations per second] performance of Agility 3 compared to Solid 3, which may be conditioned by firmware.
“With increased availability of SATA III platforms, the demand for the latest generation SSDs has grown rapidly. We are addressing this demand with new products that offer both the best performance and value for consumers. The new Agility 3 and Solid 3 SSDs make it easier than ever for consumers take advantage of the new SATA III interface. When coupled with the speed and reliability benefits that our SSDs offer over traditional hard drives, it makes the two new series the ideal choices for mobile and desktop applications," said Ryan Petersen, chief executive officer of OCZ technology Group.
Both OCZ Agility 3 and OCZ Solid 3 are based on multi-level cell (MLC) NAND flash memory made using 20nm-class process technology, are powered by SandForce SF-2281 controller, support TRIM technology, use Serial ATA-600 interface. The drives have similar 2.5" form-factors, weights, operating temperatures, power consumption, shock resistance and so on. Both drives feature ECC capability with up to 55 bits correctable per 512-byte sector. The main difference between the two drives is much higher IOPS [input/output operations per second] performance of Agility 3 compared to Solid 3, which may be conditioned by firmware.
“With increased availability of SATA III platforms, the demand for the latest generation SSDs has grown rapidly. We are addressing this demand with new products that offer both the best performance and value for consumers. The new Agility 3 and Solid 3 SSDs make it easier than ever for consumers take advantage of the new SATA III interface. When coupled with the speed and reliability benefits that our SSDs offer over traditional hard drives, it makes the two new series the ideal choices for mobile and desktop applications," said Ryan Petersen, chief executive officer of OCZ technology Group.
Intel Debuts New Enthusiast-Class Core-Logic Set with SSD-Based Caching Technology.
Intel Corp. this week released a new enthusiast-class platform for its latest Core i-series "Sandy Bridge" microprocessors. The platform is powered by the new Z68 core-logic set along with 311-series "Larsen Creek" solid-state drive (SSD) that speeds up typical workloads by working in companion with a hard disk drive (HDD).
"The Z68 chipset offers new overclocking and caching features for PC enthusiasts who want more control over their [...] desktops. The 20GB Intel SSD 311 is optimized for the new Intel Smart Response Technology caching feature in Z68 which helps speed boot times, application loads, and many other PC uses," said Daniel Snyder, a spokesman for Intel.
Nvidia Has No Immediate Plans to Integrate Baseband Capabilities into Tegra.
Nvidia Corp., which acquired Icera baseband processor designer earlier this month, said that it had no immediate plans to integrate baseband capabilities into its Tegra system-on-chip devices for handsets as well as tablets. Instead, Nvidia plans to bundle Tegra with Icera baseband processors and thus provide two of the key chips for mobile devices.
"With respect to the integration, we have no current plans to integrate [Icera's] modem. We think that the ability to offer both processors and either the two most important processors for mobile computing gives us the opportunity to leverage the momentum of Tegra and also the quite broad penetration [Icera] have already achieved with carriers all over the world to increase the momentum of both processors," said Jen-Hsun Huang, chief executive officer of Nvidia, during the quarterly conference call with financial analysts.
Previously Nvidia insisted that its intentions with Tegra included only high-end devices which do not require high levels of integration, but need maximum performance and rich feature-set. In fact, according to Nvidia, so-called super-phones and tablets do not combine application and baseband processors on the same chip; which is correct, for example, Apple's A4 and A5 SoCs that power iPhone 4/iPad and iPad 2 do not have baseband capabilities.
Read More - http://www.xbitlabs.com/news/multimedia/display/20110513110907_Nvidia_Has_No_Immediate_Plans_to_Integrate_Baseband_Capabilities_into_Tegra.html
Z68 SSD Caching with Corsair's F40 SandForce SSD
I have to admit that Intel's Z68 launch was somewhat anti-climactic for me. It was the chipset we all wanted when Sandy Bridge first arrived, but now four months after Sandy Bridge showed up there isn't all that much to be excited about - save for one feature of course: Smart Response Technology (aka SSD caching). The premise is borrowed from how SSDs are sometimes used in the enterprise space: put a small, fast SSD in front of a large array of storage and use it to cache both reads and writes. This is ultimately how the memory hierarchy works - hide the latency of larger, cheaper storage by caching frequently used data in much faster, but more expensive storage.
I believe there's a real future with SSD caching, however the technology needs to go mainstream. It needs to be available on all chipsets, something we won't see until next year with Ivy Bridge. Even then, there's another hurdle: the price of the SSD cache.
I believe there's a real future with SSD caching, however the technology needs to go mainstream. It needs to be available on all chipsets, something we won't see until next year with Ivy Bridge. Even then, there's another hurdle: the price of the SSD cache.
For $110 today you can either get a 20GB Larson Creek drive from Intel, or a 40GB SF-1200 based SSD from Corsair. Given how well SandForce's SSDs perform on their own, I wondered how one would stack up as a SSD cache
Intel's Silvermont: A New Atom Architecture
Brooke Crothers broke a very important story today - he published the name Silvermont. Atom's first incarnation came to us in 2008 as a Pentium-like dual-issue in-order microprocessor. The CPU core was named Bonnell, after the tallest point in Austin at around 750 feet. Small mountain, small core. Get it?
Bonnell and the original Atom were developed on a 5-year cadence, similar to how Intel ran things prior to the Core 2 revolution (the P6 to Netburst/Pentium 4 move took 5 years). With the original chip out in 2008, five more years would put the next major architecture shift at 2013, which happens to be exactly when the Cnet report mentions Silvermont will be introduced.
When I first met with the Atom design team they mentioned that given the power budget and manufacturing process, the Bonnell design would be in-order. You get a huge performance boost from going to an out-of-order architecture, but with it comes a pretty significant die area and power penalty. I argued that eventually Intel would have to consider taking Atom out of order, but the architects responded that Atom was married to its in-order design for 5 years.
Since 2008, Atom hasn't had any core architecture changes. Sure Intel integrated the GPU and memory controller, however the CPU still communicates with both of them over an aging FSB. The CPU itself remains mostly unchanged from what we first saw in 2008. Even Intel's 32nm Atom due out by the end of this year doesn't change its architecture, this is the same dual-issue in-order core that we've been covering since day 1. The 32nm version just runs a bit quicker and is paired with a beefier GPU.
Silvermont however changes everything. It is the first new redesign of the Atom architecture and it marks the beginning of Atom being on a tick-tock cadence. Say goodbye to 5 year updates, say hello to a new architecture every 2 years.
Read More - http://www.anandtech.com/show/4333/intels-silvermont-a-new-atom-architecture
Bonnell and the original Atom were developed on a 5-year cadence, similar to how Intel ran things prior to the Core 2 revolution (the P6 to Netburst/Pentium 4 move took 5 years). With the original chip out in 2008, five more years would put the next major architecture shift at 2013, which happens to be exactly when the Cnet report mentions Silvermont will be introduced.
When I first met with the Atom design team they mentioned that given the power budget and manufacturing process, the Bonnell design would be in-order. You get a huge performance boost from going to an out-of-order architecture, but with it comes a pretty significant die area and power penalty. I argued that eventually Intel would have to consider taking Atom out of order, but the architects responded that Atom was married to its in-order design for 5 years.
Silvermont however changes everything. It is the first new redesign of the Atom architecture and it marks the beginning of Atom being on a tick-tock cadence. Say goodbye to 5 year updates, say hello to a new architecture every 2 years.
Read More - http://www.anandtech.com/show/4333/intels-silvermont-a-new-atom-architecture
Labels:
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Tick Tock
HTC HD7: Now With NoDo
When Microsoft launched Windows Phone 7 late last year, it was readily evident that they had a solid platform on their hands, but it was missing some critical details. Chief among them? Copy-and-paste, bringing back a frequent grievance from the early iPhone days. The platform’s first update, codenamed “NoDo” (there’s a story behind that), is now out, with copy-paste support in tow, along with much improved application loading and some general performance tune-ups in the UI.
At the same time, we decided to take a look at HTC’s HD7, since it’s been my day-to-day phone for a couple of months now. It’s still the only Windows Phone you’ll find in a T-Mobile store, so it’s worth taking a look at, especially now that a very similar variant is due to hit AT&T in the coming weeks.
Read on for our thoughts on both the HD7 and Microsoft’s new update to the Windows Phone platform.
Read More - http://www.anandtech.com/show/4300/htc-hd7-now-with-nodo
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